Boost Production Rapid Thermal Processing RTP-SA-8 Annealing System

1.Basic configuration of equipment system

1.1outline

The Rapid Thermal Processing is a vertical semi-automatic 8-inch wafer rapid annealing furnace, which uses two layers of infrared halogen lamps as heat sources for heating. The internal quartz cavity is insulated and insulated, and the outer shell of the cavity is made of water-cooled aluminum alloy, ensuring uniform heating of the product and low surface temperature.

Rapid Thermal Processing adopts PID control, and the system can quickly adjust the output power of infrared halogen lamps, making temperature control more accurate.

1.2.Product features

Double layer infrared halogen lamp tube heating, rapid nitrogen cooling;

Independently developed grouped arrangement of lamp tubes to improve temperature uniformity;

Using PID algorithm control, real-time adjustment of lamp power output;

User accounts are divided into three levels of permissions for convenient information management;

The main interface of the software can display real-time parameters such as gas, temperature, vacuum degree, etc;

The system automatically saves relevant information for each process;

Automatically recognize error messages and protect the device automatically in case of abnormalities:

Overheat detection: The temperature of the water-cooled aluminum alloy on the outer shell of the chamber exceeds 70 ℃.

Thermocouple detection: During the system process, the thermocouple monitoring value does not match the set value.

Heating detection: Abnormal output power during heating.

Furnace door lock detection: Check if the door lock is locked before each process.

Gas detection: Gas pressure exceeds the set range, gas pressure is too high or too low.

Water flow detection: The inlet flow rate is lower than the default value.

Leakage detection: Leakage detected.

Emergency stop switch: Immediately stop the process and cut off the heat source.

1.3.Rapid Thermal Processing industry applications

Ion implantation annealing

Rapid annealing after ITO coating

oxide

Nitride growth

Annealing of silicide alloys

Gallium arsenide process

Ohmic contact fast alloy

Oxidative reflux

Other semiconductor rapid heat treatment processes

2.Main equipment configuration

2.1.Equipment General Parameter

2.2Configuration Checklist

Standard configuration

2.3.Common consumables

3.Appearance inspection and temporary storage requirements before installation of equipment upon entry

• After the supplier's equipment arrives, Party A is responsible for checking the number of pieces and packaging to ensure they are intact, and is responsible for safekeeping; We should also assist Shanghai Ganova in transporting the equipment to the installation site, providing convenience for installation.

• Whether the internal and external packaging of the equipment is intact, and whether there is any obvious damage, scratches, or paint peeling

• Whether there is dirt or rust inside and outside the machine

• Check if the nameplate markings are consistent with the equipment

• According to the standard configuration of the equipment in this technical agreement, count each item one by one, and fill in the details of spare parts and accessories, as well as the software name in the unboxing record to ensure complete configuration.

• The host and internal components of the brand new device should be brand new

• Store the equipment in a vibration free clean room