Wafer Dicing Machine

China Wafer Dicing Machine

0.1mm/s To 600mm/s Wafer Dicing Machine X Axis Cutting Range 260mm

X-axis Cutting speed:0.1 ～ 600mm/s

Product Name:DAD3350 Automatic Dicing Saw

Max. workpiece size:Φ8 inch (250mm × 250mm, Φ300mm user-specified specification)
Silicon Wafer Dicing Machine 260mm Automatic Dicing Saw

Product Name:DAD3350 Automatic Dicing Saw

Max. workpiece size:Φ8 inch (250mm × 250mm, Φ300mm user-specified specification)

Application:1.8 kW, 2.2 kW
Automatic Wafer Dicing Machine 8 Inch 250mm × 250mm 300mm

Product Name:DAD3350 Automatic Dicing Saw

Max. workpiece size:Φ8 inch (250mm × 250mm, Φ300mm user-specified specification)

Application:1.8 kW, 2.2 kW
8 inch Wafer Dicing Machine X Axis Cutting Range 260mm 1.8 KW 2.2 KW

Product Name:DAD3350 Automatic Dicing Saw

Max. workpiece size:Φ8 inch (250mm × 250mm, Φ300mm user-specified specification)

Application:1.8 kW, 2.2 kW
X Axis Cutting Range 260mm Wafer Dicing Machine Automatic Dicing Saw

Product Name:DAD3350 Automatic Dicing Saw

Max. workpiece size:Φ8 inch (250mm × 250mm, Φ300mm user-specified specification)

Application:1.8 kW, 2.2 kW

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