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R Type 50mm Sapphire Wafer Thickness 420μm OF length (mm) 16 LED chip

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R Type 50mm Sapphire Wafer Thickness 420μm OF length (mm) 16 LED chip

R Type 50mm Sapphire Wafer Thickness 420μm OF length (mm) 16 LED chip
R Type 50mm Sapphire Wafer Thickness 420μm OF length (mm) 16 LED chip

Large Image :  R Type 50mm Sapphire Wafer Thickness 420μm OF length (mm) 16 LED chip

Product Details:
Model Number: JDCD08-001-001
Payment & Shipping Terms:
Packaging Details: Vacuum packing in a class 10000 clean room environment,in cassettes of 25pcs or single wafer containers.
Payment Terms: T/T

R Type 50mm Sapphire Wafer Thickness 420μm OF length (mm) 16 LED chip

Description
Product Name: Sapphire Substrate Wafer Material: High Purity Al₂O₃(>99.995%)
Wafer Edge: R-type Surface Orientation: A-Plane(11-20)
Thickness: 430 ±15μm Diameter: 50.8 ±0.10
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R Type Sapphire Wafer

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50mm sapphire crystal wafer

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Sapphire Wafer 420um

50mm Sapphire Substrate Wafer High Purity Al2O3(>99.995%) Thickness 430 ± 10 μm

JDCD08-001-001 Diameter 50mm Sapphire substrate wafer , Thk 430um, crystal orientation C/M0.2, OF length (mm) 16 LED chip,substrate material

 

Unique Mechanical Properties

Sapphire as a material is extremely hard, having a Mohs hardness of 9. This is secondly only to the natural mineral Diamond, which has a Mohs hardness value of 10. As a result, it is also highly scratch-resistant, which makes it suitable for several industries. As compared to sapphire, glass has a hardness value close to 5.5.

 

Parameters

Specification
Unit Target Tolerance
Material High purity Al2O3(>99.995%)
Diameter mm 50.8 ±0.10
Thickness μm 430 ±15
Surface Orientation C-Plane(0001)
-Off Angle toward M-axis degree 0.20 ±0.10
-Off Angle toward A-axis degree 0.00 ±0.10
Flat Orientation A-Plane(11-20)
-Flat Off-set Angle degree 0.0 ±0.2
Flat Lenght mm 16.0 ±1
R-plane R9
Front surface Roughness(Ra) nm <0.3
Back surface Roughness μm 0.8~1.2μm
Front surface Quality Mirror Polished,EPI-Ready
Wafer edge R-type
Chamfer amplitude μm 80-160
Included angle radian between flat edge and round edge mm R=9
TTV μm ≤5
LTV(5x5mm) μm ≤1.5
Bow μm 0~-5
Warp μm ≤10
Laser mark   As customer required

 

 

About Us

We specialize in processing a variety of materials into wafers, substrates and customized optical glass parts.components widely used in electronics, optics, opto electronics and many other fields. We also have been working closely with many domestic and oversea universities, research institutions and companies, provide customized products and services for their R&D projects. It's our vision to maintaining a good relationship of cooperation with our all customers by our good reputations.

 

 

FAQ

Q: Are you trading company or manufacturer ?
We are factory.
Q: How long is your delivery time?
Generally it is 3-5 days if the goods are in stock.
or it is 7-10 days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra ?
Yes, we could offer the sample for free charge but do not pay the cost of freight.
Q: What is your terms of payment ?
Payment <=5000USD, 100% in advance.
Paymen >=5000USD, 80% T/T in advance , balance before shippment.

 

Contact Details
Shanghai GaNova Electronic Information Co., Ltd.

Contact Person: Xiwen Bai (Ciel)

Tel: +8613372109561

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