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Product Details:
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| Product Name: | DAD3350 Automatic Dicing Saw | Max. Workpiece Size: | Φ8 Inch (250mm × 250mm, Φ300mm User-specified Specification) |
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| Application: | 1.8 KW, 2.2 KW | Machine Weight: | Approx. 1,200kg |
| X-axis Cutting Range: | 260mm | X-axis Cutting Speed: | 0.1 ～ 600mm/s |
| Highlight: | X Axis Wafer Dicing Machine,Wafer automatic dicing saw,Wafer Dicing Machine 260mm |
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DAD3350 Wafer Dicing Machine Automatic Dicing Saw 1.8 kW, 2.2 kW
Process controls
Auto alignment, auto focus, auto kerf check, and other image recognition functions have been installed to improve equipment productivity. In addition, the microscope includes an air blow mechanism and a lens shutter to prevent contamination. As an option, a low magnification microscope can be added for rough alignment. Through condition monitoring the processing conditions and various other statuses can be known at any given time. Advanced process control features can be added as options, including an on-screen cutting water management system for cutting water flow control.
Specifications
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Specification |
Unit |
1.8 kW |
2.2 kW |
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Max. workpiece size |
- |
Φ8 inch (250 mm × 250 mm, Φ300 mm user-specified specification) |
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X-axis |
Cutting range |
mm |
260 |
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Cutting speed |
mm/s |
0.1 ～ 600 |
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Y-axis |
Cutting range |
mm |
260 |
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Index step |
mm |
0.0001 |
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Index positioning accuracy |
mm |
0.002/260 |
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Z-axis |
Max. stroke |
mm |
32.2 |
31.4 |
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Moving resolution |
mm |
0.00005 |
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Repeatability accuracy |
mm |
0.001 |
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θ-axis |
Max. rotating angle |
deg |
380 |
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Spindle |
Rated torque |
N・m |
0.29 |
0.70 |
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Revolution speed range |
min‐1 |
6,000 ～ 60,000 |
3,000 ～ 30,000 |
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Machine dimensions(W×D×H) |
mm |
900 × 1,050 × 1,800 |
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Machine weight |
kg |
Approx. 1,200 |
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* Product appearance, features, specifications, and other details may change due to technical modifications.
* Please read the standard specification sheet thoroughly before use.
Contact Person: Xiwen Bai (Ciel)
Tel: +8613372109561
