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Flat Edge Angle 16mm Patterned Sapphire Substrates Front Surface

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Flat Edge Angle 16mm Patterned Sapphire Substrates Front Surface

Flat Edge Angle 16mm Patterned Sapphire Substrates Front Surface
Flat Edge Angle 16mm Patterned Sapphire Substrates Front Surface Flat Edge Angle 16mm Patterned Sapphire Substrates Front Surface Flat Edge Angle 16mm Patterned Sapphire Substrates Front Surface Flat Edge Angle 16mm Patterned Sapphire Substrates Front Surface Flat Edge Angle 16mm Patterned Sapphire Substrates Front Surface

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Product Details:
Place of Origin: Suzhou China
Brand Name: GaNova
Certification: UKAS/ISO9001:2015
Model Number: JDCD09-001-001
Payment & Shipping Terms:
Minimum Order Quantity: 1
Packaging Details: Vacuum packing in a class 10000 clean room environment,in cassettes of 25pcs or single wafer containers.
Payment Terms: T/T

Flat Edge Angle 16mm Patterned Sapphire Substrates Front Surface

Description
Dimension: 50.80±0.10mm Thickness: 430±10μm
Flat Edge Width: 16±1.0mm Flat Edge Angle: A-plane±0.2˚
TTV: ≤5μm BOW: ≤-8~0μm
Front Surface Roughness: ≤0.25nm Back Surface Roughness: 0.8~1.2μm
Highlight:

16mm Patterned Sapphire Substrates

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pss sapphire 430um

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Flat Edge Patterned Sapphire Substrates

Flat Edge Angle 16±1.0mm Patterned Sapphire Substrates Front Surface Roughness ≤0.25nm

2inch Patterned Sapphire Substrates,LED Chip,Substrate Material

 

Patterned Sapphire Substrates (PSS) are fabricated and used in GaN-based LEDs in order to increase the internal quantum efficiency by reducing GaN crystal defects. They also can improve external quantum efficiency by increasing the reflection area.

R-plane sapphire substrates are preferred for hetero-epitaxial deposition of silicon. It is used in the manufacturing of semiconductor, microwave, and microelectronic IC applications.

 

2inch Patterned sapphire substrate
Item Al2O3

 

 

Flat Edge Angle 16mm Patterned Sapphire Substrates Front Surface 0

 

 

 

 

 

 

 

 

 

Dimension 50.80±0.10mm
Thickness 430±10μm
Flat edge width

 

16±1.0mm

Flat edge angle A-plane±0.2o
TTV ≤5μm
BOW ≤-8~0μm
Front Surface Roughness ≤0.25nm
Back Surface Roughness 0.8~1.2μm
Edge Round
Laser making back

 

About Us

We specialize in processing a variety of materials into wafers, substrates and customized optical glass parts.components widely used in electronics, optics, opto electronics and many other fields. We also have been working closely with many domestic and oversea universities, research institutions and companies, provide customized products and services for their R&D projects. It's our vision to maintaining a good relationship of cooperation with our all customers by our good reputations.

 

 

FAQ

Q: Are you trading company or manufacturer ?
We are factory.
Q: How long is your delivery time?
Generally it is 3-5 days if the goods are in stock.
or it is 7-10 days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra ?
Yes, we could offer the sample for free charge but do not pay the cost of freight.
Q: What is your terms of payment ?
Payment <=5000USD, 100% in advance.
Paymen >=5000USD, 80% T/T in advance , balance before shippment.

 

Contact Details
Shanghai GaNova Electronic Information Co., Ltd.

Contact Person: Xiwen Bai (Ciel)

Tel: +8613372109561

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