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A Face GaN Epitaxial Wafer Free Standing GaN Substrates

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A Face GaN Epitaxial Wafer Free Standing GaN Substrates

A Face GaN Epitaxial Wafer Free Standing GaN Substrates
A Face GaN Epitaxial Wafer Free Standing GaN Substrates

Large Image :  A Face GaN Epitaxial Wafer Free Standing GaN Substrates

Product Details:
Place of Origin: Suzhou China
Brand Name: GaNova
Certification: UKAS/ISO9001:2015
Model Number: JDCD01-001-006
Payment & Shipping Terms:
Packaging Details: Vacuum packing in a class 10000 clean room environment,in cassettes of 6pcs or single wafer containers.
Delivery Time: 3-4 week days
Payment Terms: T/T
Supply Ability: 10000pcs/month

A Face GaN Epitaxial Wafer Free Standing GaN Substrates

Description
Product Name: A Face Free-standing GaN Substrates Dimensions: 5 X 10mm²
Thickness: 350 ±25µm TTV: ≤ 10µm
BoW: - 10µm ≤ BOW ≤ 10µm Macro Defect Density: 0cm⁻²
Highlight:

A Face GaN Epitaxial Wafer

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GaN Substrate ISO

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GaN Epitaxial Wafer Free Standing

5*10.5mm2 A Face Free-Standing GaN Substrates Thickness 350 ±25 µm

5*10.5mm2 A-face Un-doped SI-type free-standing GaN single crystal substrate Resistivity > 106 Ω·cm RF devices wafer

 


Overview
Gallium Nitride (GaN) substrate is a high-quality single-crystal substrate. It is made with original HVPE method and wafer processing technology, which has been originally developed for many years. The features are high crystalline, good uniformity, and superior surface quality.

 

Power density is greatly improved in gallium nitride devices compared to silicon ones because GaN has the capacity to sustain much higher switching frequencies. It also has an increased ability to sustain elevated temperatures.

 

A face Free-standing GaN Substrates
Item GaN-FS-A-U-S

GaN-FS-A-N-S

GaN-FS-A-SI-S

A Face GaN Epitaxial Wafer Free Standing GaN Substrates 0

Remarks:

A circular arc angle (R < 2 mm) is used for distinguishing the front and back surface.

Dimensions 5 x 10 mm2
Thickness 350 ±25 µm
Orientation

A plane (11-20) off angle toward M-axis 0 ±0.5°

A plane (11-20) off angle toward C-axis - 1 ±0.2°

Conduction Type N-type

N-type

Semi-Insulating
Resistivity (300K) < 0.1 Ω·cm < 0.05 Ω·cm > 106 Ω·cm
TTV ≤ 10 µm
BOW - 10 µm ≤ BOW ≤ 10 µm
Front Surface Roughness

< 0.2 nm (polished);

or < 0.3 nm (polished and surface treatment for epitaxy)

Back Surface Roughness

0.5 ~1.5 μm

option: 1~3 nm (fine ground); < 0.2 nm (polished)

Dislocation Density From 1 x 105 to 3 x 106 cm-2
Macro Defect Density 0 cm-2
Useable Area > 90% (edge exclusion)
Package Packaged in a class 100 clean room environment, in 6 PCS container, under a nitrogen atmosphere

 

 

Appendix: The diagram of miscut angle

A Face GaN Epitaxial Wafer Free Standing GaN Substrates 1

 

If δ1= 0 ±0.5°, then A plane (11-20) off angle toward M-Axis is 0 ±0.5°.

If δ2= - 1 ±0.2°, then A plane (11-20) off angle toward C-Axis is - 1 ±0.2°.

 

About Us

We specialize in processing a variety of materials into wafers, substrates and customized optical glass parts.components widely used in electronics, optics, opto electronics and many other fields. We also have been working closely with many domestic and oversea universities, research institutions and companies, provide customized products and services for their R&D projects. It's our vision to maintaining a good relationship of cooperation with our all customers by our good reputations.

 

 

FAQ

Q: Are you trading company or manufacturer ?
We are factory.
Q: How long is your delivery time?
Generally it is 3-5 days if the goods are in stock.
or it is 7-10 days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra ?
Yes, we could offer the sample for free charge but do not pay the cost of freight.
Q: What is your terms of payment ?
Payment <=5000USD, 100% in advance.
Paymen >=5000USD, 80% T/T in advance , balance before shippment.

Contact Details
Shanghai GaNova Electronic Information Co., Ltd.

Contact Person: Xiwen Bai (Ciel)

Tel: +8613372109561

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