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Prime 2'' Silicon Wafer Standard <10 μm Maximum Capabilities<5um

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Prime 2'' Silicon Wafer Standard <10 μm Maximum Capabilities<5um

Prime 2'' Silicon Wafer Standard &lt;10 μm Maximum Capabilities&lt;5um
Prime 2'' Silicon Wafer Standard &lt;10 μm Maximum Capabilities&lt;5um

Large Image :  Prime 2'' Silicon Wafer Standard <10 μm Maximum Capabilities<5um

Product Details:
Place of Origin: Suzhou China
Brand Name: GaNova
Certification: UKAS/ISO9001:2015
Model Number: JDCD06-001-002
Payment & Shipping Terms:
Minimum Order Quantity: 1
Packaging Details: Vacuum packing in a class 10000 clean room environment,in cassettes of 25pcs or single wafer containers.
Delivery Time: 3-4 week days
Payment Terms: T/T
Supply Ability: 50000pcs/month

Prime 2'' Silicon Wafer Standard <10 μm Maximum Capabilities<5um

Description
Diameter: 2" Grade: Prime
Growth Method: CZ Resistivity: 0.001-100 Ohm-cm
Surface Finished: P/E,P/P,E/E,G/G TTV(μm): Standard <10μm,Maximum Capabilities<5μm
Bow/Warp: Standard <40μm,Maximum Capabilities<20μm Particle: <10@0.5μm; <10@0.3μm; <10@0.2μm;
Highlight:

2'' Silicon Wafer

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CZ si wafer

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UKAS Silicon Wafer

Prime 2" Silicon Wafer TTV(μm) Standard <10μm,Maximum Capabilities<5μm

2-Inch Silicon Wafer MEMS Devices, Integrated Circuits,Dedicated Substrates For Discrete Devices

 


Overview

The machining performance results of Si with two-different resistivities are discussed using a die-sinking micro-electrical discharge machining technique while varying discharge energy parameters. Moreover, a novel heat-assisted micro-electrical discharge machine technique is performed for machining Si without any conductive layer involved.

 

 

Specification

silicon wafer

Diameter

 

2"/3"/4"/5"/6"/8"/12"
Grade Prime
Growth Method CZ
Orientation <1-0-0>,<1-1-1>,<1-1-0>
Type/Dopant P Type/Boron,N Type/Phos,N Type/As, N Type/Sb
Thickness(μm) 279/380/525/625/675/725/775
Thickness Tolerance Standard ± 25μm,Maximum Capabilit/ies ± 5μm
Resistivity 0.001-100 ohm-cm
Surface Finished P/E,P/P,E/E,G/G
TTV(μm) Standard <10 μm,Maximum Capabilities<5 μm
Bow/Warp Standard <40 μm,Maximum Capabilities<20 μm
Particle <10@0.5μm; <10@0.3μm; <10@0.2μm;

 

 

 

About Us

We specialize in processing a variety of materials into wafers, substrates and customized optical glass parts.components widely used in electronics, optics, opto electronics and many other fields. We also have been working closely with many domestic and oversea universities, research institutions and companies, provide customized products and services for their R&D projects. It's our vision to maintaining a good relationship of cooperation with our all customers by our good reputations.

 

 

FAQ

Q: Are you trading company or manufacturer ?
We are factory.
Q: How long is your delivery time?
Generally it is 3-5 days if the goods are in stock.
or it is 7-10 days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra ?
Yes, we could offer the sample for free charge but do not pay the cost of freight.
Q: What is your terms of payment ?
Payment <=5000USD, 100% in advance.
Paymen >=5000USD, 80% T/T in advance , balance before shippment.

 

Contact Details
Shanghai GaNova Electronic Information Co., Ltd.

Contact Person: Xiwen Bai (Ciel)

Tel: +8613372109561

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