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JDCD06-001-002 3-Inch Silicon Wafer MEMS Devices, Integrated Circuits,Dedicated Substrates For Discrete Devices

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JDCD06-001-002 3-Inch Silicon Wafer MEMS Devices, Integrated Circuits,Dedicated Substrates For Discrete Devices

JDCD06-001-002 3-Inch Silicon Wafer MEMS Devices, Integrated Circuits,Dedicated Substrates For Discrete Devices
JDCD06-001-002 3-Inch Silicon Wafer MEMS Devices, Integrated Circuits,Dedicated Substrates For Discrete Devices

Large Image :  JDCD06-001-002 3-Inch Silicon Wafer MEMS Devices, Integrated Circuits,Dedicated Substrates For Discrete Devices

Product Details:
Place of Origin: Suzhou China
Brand Name: GaNova
Certification: UKAS/ISO9001:2015
Model Number: JDCD06-001-002
Payment & Shipping Terms:
Minimum Order Quantity: 1
Packaging Details: Vacuum packing in a class 10000 clean room environment,in cassettes of 25pcs or single wafer containers.
Delivery Time: 3-4 week days
Payment Terms: T/T
Supply Ability: 50000pcs/month

JDCD06-001-002 3-Inch Silicon Wafer MEMS Devices, Integrated Circuits,Dedicated Substrates For Discrete Devices

Description
Diameter: 3" Grade: Prime
Growth Method: CZ Orientation: <1-0-0>,<1-1-1>,<1-1-0>
Type/Dopant: P Type/Boron,N Type/Phos,N Type/As, N Type/Sb Thickness(μm): 380
Thickness Tolerance: Standard ± 25μm,Maximum Capabilities ± 5μm Resistivity: 0.001-100 Ohm-cm
Surface Finished: P/E,P/P,E/E,G/G TTV(μm): Standard <10 Um,Maximum Capabilities<5 Um
Bow/Warp: Standard <40 Um,Maximum Capabilities<20 Um Particle: <10@0.5um; <10@0.3um; <10@0.2um;
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Integrated Circuits Silicon Wafer

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Discrete Devices Silicon Wafer

3-inch silicon wafer MEMS devices, integrated circuits,dedicated substrates for discrete devices

 


Overview
Silicon wafers act as a substrate for microelectronic devices and are especially useful in building electronic circuits because of their conductivity and affordability. Silicon comes seventh as the most common element in the entire universe and the second most common element on earth. Some common materials that contain silicon are beach sand, quartz, flint, agate, among others.

Silicon is the major component in construction materials like brick, cement, and glass. It also tops the chart as the most common semiconductor which has made it to be the most widely used in the electronic and technology sector

 

 

 

Specification

silicon wafer

Diameter

 

2"/3"/4"/5"/6"/8"/12"
Grade Prime
Growth Method CZ
Orientation <1-0-0>,<1-1-1>,<1-1-0>
Type/Dopant P Type/Boron,N Type/Phos,N Type/As, N Type/Sb
Thickness(μm) 279/380/525/625/675/725/775
Thickness Tolerance Standard ± 25μm,Maximum Capabilit/ies ± 5μm
Resistivity 0.001-100 ohm-cm
Surface Finished P/E,P/P,E/E,G/G
TTV(μm) Standard <10 um,Maximum Capabilities<5 um
Bow/Warp Standard <40 um,Maximum Capabilities<20 um
Particle <10@0.5um; <10@0.3um; <10@0.2um;

 

 

 

About Us

We specialize in processing a variety of materials into wafers, substrates and customized optical glass parts.components widely used in electronics, optics, opto electronics and many other fields. We also have been working closely with many domestic and oversea universities, research institutions and companies, provide customized products and services for their R&D projects. It's our vision to maintaining a good relationship of cooperation with our all customers by our good reputations.

 

 

FAQ

Q: Are you trading company or manufacturer ?
We are factory.
Q: How long is your delivery time?
Generally it is 3-5 days if the goods are in stock.
or it is 7-10 days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra ?
Yes, we could offer the sample for free charge but do not pay the cost of freight.
Q: What is your terms of payment ?
Payment <=5000USD, 100% in advance.
Paymen >=5000USD, 80% T/T in advance , balance before shippment.

 

Contact Details
Shanghai GaNova Electronic Information Co., Ltd.

Contact Person: Xiwen Bai (Ciel)

Tel: +8613372109561

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