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Growth Method CZ Silicon Wafer 5" Orientation <1-0-0>, <1-1-1>, <1-1-0>

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Growth Method CZ Silicon Wafer 5" Orientation <1-0-0>, <1-1-1>, <1-1-0>

Growth Method CZ Silicon Wafer 5&quot; Orientation &lt;1-0-0&gt;, &lt;1-1-1&gt;, &lt;1-1-0&gt;
Growth Method CZ Silicon Wafer 5&quot; Orientation &lt;1-0-0&gt;, &lt;1-1-1&gt;, &lt;1-1-0&gt;

Large Image :  Growth Method CZ Silicon Wafer 5" Orientation <1-0-0>, <1-1-1>, <1-1-0>

Product Details:
Place of Origin: Suzhou China
Brand Name: GaNova
Certification: UKAS/ISO9001:2015
Model Number: JDCD06-001-002
Payment & Shipping Terms:
Minimum Order Quantity: 1
Packaging Details: Vacuum packing in a class 10000 clean room environment,in cassettes of 25pcs or single wafer containers.
Delivery Time: 3-4 week days
Payment Terms: T/T
Supply Ability: 50000pcs/month

Growth Method CZ Silicon Wafer 5" Orientation <1-0-0>, <1-1-1>, <1-1-0>

Description
Diameter: 2" Grade: Prime
Growth Method: CZ Orientation: <1-0-0>,<1-1-1>,<1-1-0>
Thickness(μm): 279 Thickness Tolerance: Standard ± 25μm,Maximum Capabilities ± 5μm
Resistivity: 0.001-100 Ohm-cm Surface Finished: P/E,P/P,E/E,G/G
Highlight:

CZ Silicon Wafer

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Silicon 5 inch wafer

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polished silicon wafer

Growth Method CZ Silicon Wafer Orientation <1-0-0>,<1-1-1>,<1-1-0>

2-Inch Silicon Wafer MEMS Devices, Integrated Circuits,Dedicated Substrates For Discrete Devices

 


Overview

Silicon wafers after cutting have sharp edges, and they chip easily. Wafer edge is shaped to remove sharp, brittle edges; rounded edge minimizes risk for slipping, too. Edge shaping operation makes the wafer perfectly round (off-cut wafers are oval shaped after slicing), the diameter is adjusted, and orientation flat(s) or notch is dimensioned or made.

 

 

Specification

silicon wafer

Diameter

 

2"/3"/4"/5"/6"/8"/12"
Grade Prime
Growth Method CZ
Orientation <1-0-0>,<1-1-1>,<1-1-0>
Type/Dopant P Type/Boron,N Type/Phos,N Type/As, N Type/Sb
Thickness(μm) 279/380/525/625/675/725/775
Thickness Tolerance Standard ± 25μm,Maximum Capabilit/ies ± 5μm
Resistivity 0.001-100 ohm-cm
Surface Finished P/E,P/P,E/E,G/G
TTV(μm) Standard <10 μm,Maximum Capabilities<5 μm
Bow/Warp Standard <40 μm,Maximum Capabilities<20 μm
Particle <10@0.5μm; <10@0.3μm; <10@0.2μm;

 

 

 

About Us

We specialize in processing a variety of materials into wafers, substrates and customized optical glass parts.components widely used in electronics, optics, opto electronics and many other fields. We also have been working closely with many domestic and oversea universities, research institutions and companies, provide customized products and services for their R&D projects. It's our vision to maintaining a good relationship of cooperation with our all customers by our good reputations.

 

 

FAQ

Q: Are you trading company or manufacturer ?
We are factory.
Q: How long is your delivery time?
Generally it is 3-5 days if the goods are in stock.
or it is 7-10 days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra ?
Yes, we could offer the sample for free charge but do not pay the cost of freight.
Q: What is your terms of payment ?
Payment <=5000USD, 100% in advance.
Paymen >=5000USD, 80% T/T in advance , balance before shippment.

 

Contact Details
Shanghai GaNova Electronic Information Co., Ltd.

Contact Person: Xiwen Bai (Ciel)

Tel: +8613372109561

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